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The Connector Conundrum

Aries Electronics
Wednesday, May 19 2010

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How times have changed. Today devices can be packaged as DSPs, LGAs, SRAMs, DRAMs, MicroBGAs, and many more. Lead pitches can be 1.27mm, 1mm, 0.8mm, 0.5mm, 0.4mm, 0.3mm, and more. Device sizes can be as small as 0.2mm x0.2mm. And, there is demand to test these devices to 10GHz and beyond. There is no more one size fits all.

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