Remaining at the forefront of technological advancements in the printed wiring industry requires a proven combination of process methodology, state-of-the-art processing equipment, and a clear-cut understanding of customer base and customer application parameters.

As the design hurdles related to the electronics packaging market are continuously being raised, the primary focus remains that of increasing density, enhanced performance, and improved reliability. Moreover, as component densities increase, so does the difficulty in maintaining those performance and reliability factors. We are rapidly approaching a point in the evolution of electronics where thermal management ultimately becomes a design engineer’s top priority.

It is widely accepted that increased power density, implementation of higherwattage components, and the upward spiral in switching frequencies have become the primary drivers in the search for more efficient and cost-effective thermal management. This article will address some of the industry issues and solutions related to thermal management.

Thermal Impedance

Figure 1. The Arrhenius Chart states that for each 10°C rise in component junction temperature, life expectancy will be halved.

The higher the thermal impedance of a given board material, the lower the ability of that particular board material to draw heat away from component junctions, as well as impeding the transfer of component junction heat to any ancillary sinking materials that may be utilized. An excellent example of the importance of good thermal management is clearly depicted in the Arrhenius Chart (Figure 1), which basically states that for each 10°C rise in component junction temperature, component junction life expectancies will be halved.