The Need for Powerful, Small, Rugged Computers

For system designers, the resulting challenge is to put more processing power adjacent to sensors inside smaller platforms. They require higher levels of computing power in very small packages that are rugged enough to withstand operation within deployed UVs. While needs vary across a range of implementations, requirements for next-generation embedded computing systems can be summarized as follows:

• Greater Than 100 GFLOPS — Systems can certainly be implemented with less than 100 GFLOPS of processing power, but image-exploitation algorithms, such as change detection, georegistration, or automatic target recognition (ATR), demand that level of processing or more.
• Less Than 10 Pounds — Desired weight and size are, of course, platform dependent. There is a class of smaller UAVs with a total payload capacity ranging from 60 to 200 pounds. In a general sense, it is reasonable to allocate up to 10 pounds of that payload capacity to computing, but not much more.
• Significantly Smaller Than Half-ATR Form Factor — The ATR system for standardized packaging of electronics was created to meet the needs of deployment in manned aircraft. New generations of UVs are not built to fit human dimensions, so it is not surprising that the ATR form factor, even in its half-ATR short form, is simply too big.
• Flexible Enough to Support a Range of I/O Protocols — An embedded computing system that is processing sensor input must be flexible enough to support multiple types of sensors. Sensor payloads can change from one type to another, or use multiple types within one payload. This translates into a need to support multiple I/O protocols, often on a customized basis.
• Able to Withstand Difficult Environmental Conditions — Despite their technical sophistication, defense electronics systems must deliver uncompromised performance under difficult environmental conditions, including excessive heat, humidity, poor air quality, high altitude, shock, and vibration. Embedded computers must be able to keep their electronics from overheating, even when temperatures range up to 55°C and the air is too thin to be used for cooling. At the same time, they must possess the enhanced mechanical integrity to withstand high shock and vibration forces at various frequencies.